教授 博士生导师
性别：男
毕业院校：重庆大学
学历：硕士研究生毕业
学位：理学硕士学位
在职信息：离退休人员
所在单位：材料与能源学院
学科：应用化学
材料科学与工程
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- [1] A composite of epoxy resin/copper (II) acetylacetonae as catalyst of copper addition on insulated substrate,Journal of Materials Science: Materials in Electronics,, vol. 2018: 1-6, Mar 2018.
- [2] Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification,Surface and Coatings Technology,, vol. 2018, 333, Jan 2018.
- [3] Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core,Composites Part B: Engineering,, vol. 2018, 138, Jan 2018.
- [4] A comparison of typical additives for copper electroplating based on theoretical computation,Computational Materials Science,, vol. 2018, 147, Jan 2018.
- [5] Computational analysis and experimental evidence of two typical levelers for acid copper electroplating,Electrochimica Acta,, vol. 2018, 273, Apr 2018.
- [6] Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process,Circuit World,, vol. 2018, 44, Apr 2018.
- [7] Electrochemical Factors of Levelers on Plating Uniformity of Through-Holes: Simulation and Experiments,Journal of The Electrochemical Society,, vol. 2018, 165, Jun 2018.
- [8] Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation.,Circuit World,, vol. 2018, 44, May 2018.
- [9] Electric and thermal performance of poly(phenylene oxide)-based composites with synergetic modification of carbon nanotubes and nanoplatelets,Polymer Composites,, vol. 2018, 39, Feb 2018.
- [10] Mechanism analysis of microvia filling based on multiphysics coupling,Circuit World,, vol. 2018, 44, Jan 2018.
- [11] Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole,Electrochimica Acta,, vol. 2018, 283, Jun 2018.
- [12] Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles.,Composites Part B: Engineering,, vol. 2018, 154, Aug 2018.
- [13] Graphene-coated copper calcium titanate to improve dielectric performance of PPO-based composite.,Materials Letters,, vol. 2018, 233, Sep 2018.
- [14] Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates,Composites Part B: Engineering,, vol. 2019, 158, Jan 2019.
- [15] Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL,Applied Surface Science, vol. 479 (2019), Feb 2019.
- [16] Competitive Adsorption between SPS and EO/PO on Copper Surface for Accelerating Trench Filling,Journal of The Electrochemical Society,, vol. 166 (2019, Feb 2019.
- [17] Accelerator Pre-Adsorption to Speed Up Copper Electroplating Microvia Filling,Journal of The E lectrochemical Society,, vol. 166（2019）, Feb 2019.
- [18] surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film,Journal of the Taiwan Institute of Chemical Engineers, vol. 97 (2019), Apr 2019.
- [19] Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes,Journal of the Taiwan Institute of Chemical Engineers, vol. 100 (2019), Mar 2019.
- [20] A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core,Journal of Magnetism and Magnetic Materials, vol. 489 (2019, May 2019.
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